Title :
Automatic monitoring and analysis of engineering experiments
Author :
Beal, Glade ; Moller, Steven
Author_Institution :
Nat. Semicond. Corp., Annapolis Junction, MA, USA
Abstract :
Yield and process improvement experiments generate enormous amounts of data that need to be analyzed. The sheer volume of data tends to overwhelm even the most enthusiastic engineer. A “hands-off” analysis routine that did all the number crunching for them was needed. This paper describes a program that runs in the background, analyzing experimental results using a stepwise regression technique that tests for multivariate effects and a nonparametric analysis of variance. It produces and stores an array of charts and summaries in a standard format for review by any one in the engineering staff
Keywords :
integrated circuit yield; nonparametric statistics; process monitoring; statistical analysis; multivariate effects; nonparametric analysis; process improvement experiments; standard format; stepwise regression technique; yield improvement experiments; Analysis of variance; Computerized monitoring; Data analysis; Data engineering; Design engineering; Design for experiments; Information analysis; Phased arrays; Statistical analysis; Testing;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-5403-6
DOI :
10.1109/ISSM.1999.808826
