Investigating PCB traces for fine pitch applications

Author

Geczy, Attila ; Illyefalvi-Vitez, Zsolt

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2010

fDate

23-26 Sept. 2010

Firstpage

147

Lastpage

152

Abstract

Surface mounted (SM) components are considered to be dominant in electronics technology. Fine pitch SM components are becoming common due to miniaturization tendencies. Ball Grid Array (BGA) components are classified as fine pitch, if the pitch is 1 mm (39 mil) or smaller [1]. These ICs desire careful approach in Printed Circuit Board (PCB) design. In order to compare the electrical performance of PCBs, two PCB interconnection boards were designed with different wiring patterns for a 650 μm pitch commercial BGA. A footprint-compatible dummy BGA was also designed, produced and used to form daisy chain with the PCB patterns. The inductance of the different geometries of the traces on the PCBs and the resistance - varying according to the skin effect at higher frequencies [2] - were calculated and verified by measurements. The skin effect was simulated by Finite Element Method (FEM). The influence of the PCB fabrication deviations was also studied.

Keywords

ball grid arrays; fine-pitch technology; finite element analysis; integrated circuit interconnections; printed circuit design; skin effect; surface mount technology; BGA component; PCB design; PCB fabrication deviation; PCB interconnection board; PCB pattern; ball grid array; electrical performance; electronics technology; fine pitch SM component; finite element method; footprint-compatible dummy BGA; printed circuit board; skin effect; surface mounted component; wiring pattern; Copper; Geometry; Inductance; Resistance; Skin; Skin effect; PCB; fine pitch; on-board inductance; skin effect; trace;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for

Conference_Location

Pitesti

Print_ISBN

978-1-4244-8123-1

Type

conf

DOI

10.1109/SIITME.2010.5653654

Filename

5653654