DocumentCode
3369225
Title
Board driven I/O planning & optimization
Author
Park, John F.
Author_Institution
Mentor Graphics, Longmont, CO, USA
fYear
2010
fDate
7-11 Nov. 2010
Firstpage
395
Lastpage
397
Abstract
The overall cost of getting a chip ship in volume is a concern for many companies in today´s market. Industry leading companies are starting to implement co-design flows in hopes of reducing overall design cycles and cost. This paper proposes a novel approach to developing a co-design flow that is based on a new intelligent die abstract model (VDM) and a board driven methodology. This methodology has been used to save over 25% on a high volume production printed circuit board (PCB).
Keywords
Vienna development method; printed circuit design; printed circuits; PCB; board driven I/O planning; board driven methodology; chip ship; codesign flows; intelligent die abstract model; overall design cost; overall design cycles; printed circuit board; Companies; Integrated circuit modeling; Layout; Optimization; Planning; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
978-1-4244-8193-4
Type
conf
DOI
10.1109/ICCAD.2010.5653704
Filename
5653704
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