• DocumentCode
    3369786
  • Title

    Analysis of functional recovery in cells treated with co-block polymers after thermal injury

  • Author

    Merchant, F.A. ; Holmes, W.H. ; Toner, M.

  • Author_Institution
    Center for Eng. in Med. & Surg. Services, Massachusetts Gen. Hospital, Boston, MA, USA
  • Volume
    5
  • fYear
    1996
  • fDate
    31 Oct-3 Nov 1996
  • Firstpage
    2182
  • Abstract
    The purpose of this study was to facilitate the functional recovery of thermally injured cells by employing synthetically engineered biomaterials (surfactant molecules) to stabilize the plasma membrane supramolecular assembly. The authors have employed morphological and functional viability assays to quantify the survival of heat shocked cells treated with triblock polymer Poloxamer 188 (P-188). The viability of the cells was assessed using two different assays, namely; evaluation of morphology, and cell function via the ability of cells to reorganize fibroblasts populated collagen lattices (EPCLs). The results of this study indicate that low concentrations of P-188 were effective in increasing both morphological and functional viability of cells following heat injury. Further, it appears that there exists a time window during which the viability of cells treated with P-188 is enhanced
  • Keywords
    cellular biophysics; hyperthermia; polymer blends; Poloxamer 188; cell function; cell viability; cellular functional recovery; co-block polymer treatment; fibroblasts populated collagen lattices; functional viability; heat injury; heat shocked cells; plasma membrane supramolecular assembly; surfactant molecules; synthetically engineered biomaterials; Biomedical engineering; Biomembranes; Cells (biology); Injuries; Lattices; Morphology; Plasma temperature; Polymers; Surgery; Thermal engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1996. Bridging Disciplines for Biomedicine. Proceedings of the 18th Annual International Conference of the IEEE
  • Conference_Location
    Amsterdam
  • Print_ISBN
    0-7803-3811-1
  • Type

    conf

  • DOI
    10.1109/IEMBS.1996.646486
  • Filename
    646486