DocumentCode :
3369897
Title :
A new kind of microstructures applied to Closed Loop Thermosyphons
Author :
Dashi, Su ; Yajun, Liu ; Wei, Zhou
Author_Institution :
Sch. of Mech. Eng., Shaoguan Univ., Shaoguan, China
fYear :
2009
fDate :
9-12 Aug. 2009
Firstpage :
2167
Lastpage :
2172
Abstract :
Three kinds of Enhanced Boiling Microstructures(EBMS) were fabricated. A series of pool boiling experiments were carried out to estimate the performance of all kinds of EBMS. According to the results of pool boiling experiments, the best EBMS, which have the lowest wall superheat and highest Critical Heat Flux (CHF), was chosen as the most important part of a new designed Two-phase Closed Loop Thermosyphons(TCLT). The aim of the TCLT is to dissipate high heat flux of some electronic devices. The TCLT was composed of an evaporator, a condenser, a subcooler and connecting tubes. A series of dissipating heat experiments of the TCLT were carried out. Results show that thermal resistance of the TCLT can reach minimum value 0.077°C/W, and the highest heat flux that the TCLT can transfer is 44.2W/cm2 when pure water is the working fluid.
Keywords :
condensation; cooling; evaporation; microfabrication; micromechanical devices; micromechanics; thermal resistance; EBMS fabrication; TCLT; condenser; critical heat flux; enhanced boiling microstructures; evaporator; heat dissipation; subcooler; thermal resistance; two-phase closed loop thermosyphons; Central Processing Unit; Cooling; Copper; Heat transfer; Microchannel; Microstructure; Resistance heating; Surface discharges; Surface resistance; Thermal resistance; Enhanced boiling; Microstructure; Thermosyphon; Two-phase heat transfer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mechatronics and Automation, 2009. ICMA 2009. International Conference on
Conference_Location :
Changchun
Print_ISBN :
978-1-4244-2692-8
Electronic_ISBN :
978-1-4244-2693-5
Type :
conf
DOI :
10.1109/ICMA.2009.5246546
Filename :
5246546
Link To Document :
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