DocumentCode :
3369970
Title :
Low power embedded memory design – process to system level considerations
Author :
Terzioglu, Esin ; Yoon, Sei Seung ; Jung, ChangHo ; Chaba, Ritu ; Boynapalli, Venu ; Abu-Rahma, Mohamed ; Wang, Joseph ; Yang, Sam ; Nallapati, Giri ; Thean, Aaron ; Chidambaram, Chidi ; Han, Michael ; Yeap, Geoffrey ; Sani, Mehdi
Author_Institution :
Qualcomm Inc., San Diego, CA, USA
fYear :
2011
fDate :
2-4 May 2011
Firstpage :
1
Lastpage :
4
Abstract :
Embedded memories are widely used in low power System-on-Chip (SoC) applications. Low power performance can be optimized with process, circuits, architecture and system level co-development. In this paper, low power design considerations are described in advanced technology nodes to address memory leakage and active power dissipation. Memory bit cell design in context of process technology definition, circuit techniques at the macro design level, and chip-level integration considerations for low power are described.
Keywords :
digital storage; system-on-chip; SoC; active power dissipation; low-power embedded memory design; memory bit cell design; memory leakage; system level considerations; system-on-chip; Logic gates; Memory management; Microprocessors; Multiplexing; Random access memory; Registers; Semiconductor memory; low power design; random access memory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IC Design & Technology (ICICDT), 2011 IEEE International Conference on
Conference_Location :
Kaohsiung
ISSN :
Pending
Print_ISBN :
978-1-4244-9019-6
Type :
conf
DOI :
10.1109/ICICDT.2011.5783221
Filename :
5783221
Link To Document :
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