Title :
Landing dynamic analysis for landing leg of lunar lander using Abaqus/Explicit
Author :
Dongping Liang ; Hongyou Chai ; Tianzhi Chen
Author_Institution :
Beijing Inst. of Spacecraft Syst. Eng., Beijing, China
Abstract :
One of the major tasks in the design and optimization process of a new landing gear system for a lunar lander is to accurately determine the loads and energy absorption capability during the landing event. The works of this paper describes a new approach of landing impact dynamic analysis using nonlinear finite element method. Abaqus/Explicit, which is part of Abaqus suite of finite element analysis software, is selected to simulate the landing event for its excellent nonlinear, transient dynamics capabilities. The aluminum honeycomb shock absorber is modeled by plastic crushable foam material model, while the lunar soil is modeled by Drucker-Prager/Cap material model. Simulation results, including the load at connector between structure and landing gear, acceleration response of structure and dissipated energy by the shock absorber and lunar soil, are given and discussed. It shows that the performance of landing gear meets the design requirements.
Keywords :
acceleration; design engineering; finite element analysis; gears; honeycomb structures; impact (mechanical); instrument landing systems; lunar interior; optimisation; plastics; polymer foams; shock absorbers; Abaqus/Explicit suite; acceleration response; aluminum honeycomb shock absorber; connector; energy absorption capability; energy dissipation; finite element analysis software; landing event simulation; landing gear system design; landing gear system optimization; landing impact dynamic analysis; landing leg; load determination; lunar lander; lunar soil; nonlinear finite element method; plastic crushable foam material model; transient dynamics capabilities; Finite element methods; Gears; Joints; Load modeling; Moon; Shock absorbers; Soil; honeycomb shock absorber; impact dynamics; landing gear; lunar lander;
Conference_Titel :
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location :
Harbin, Heilongjiang
Print_ISBN :
978-1-61284-087-1
DOI :
10.1109/EMEIT.2011.6023924