A Manufacturable Chip-Scale Atomic Clock

Author

Youngner, D.W. ; Lust, L.M. ; Carlson, D.R. ; Lu, S.T. ; Forner, L.J. ; Chanhvongsak, H.M. ; Stark, T.D.

Author_Institution

Honeywell Aerosp. Res. Labs., Plymouth

fYear

2007

fDate

10-14 June 2007

Firstpage

39

Lastpage

44

Abstract

Several factors are converging to enable atomic clocks to be manufactured with very small dimensions and run at low operating power. MOEMS technology, high-speed vcsels, microelectronics, wafer-scale packaging, and the all-optical CPT method of exciting atomic transitions are key ingredients in the quest to make precision time-keeping devices with chip-scale dimensions. In this paper we report on the design and process that enable an atomic clock to be made with a total volume of 1.7 cm³, a total power budget of 57 mWatts, and an Allan Deviation at 1 hour of 5E-12.

Keywords

atomic clocks; chip scale packaging; light coherence; radiation pressure; wafer level packaging; MOEMS technology; all-optical CPT method; coherent population trapping; high-speed vcsel; manufacturable chip-scale atomic clock; microelectronics; power 57 mW; time 1 hour; wafer-scale packaging; Assembly; Atomic clocks; Dark states; Laser excitation; Manufacturing; Optical polarization; Stationary state; Surface emitting lasers; Vertical cavity surface emitting lasers; Wafer scale integration; CPT; CSAC; MEMS; MOEMS; atomic clocks; spectroscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International

Conference_Location

Lyon

Print_ISBN

1-4244-0842-3

Electronic_ISBN

1-4244-0842-3

Type

conf

DOI

10.1109/SENSOR.2007.4300066

Filename

4300066