Title :
MEMS Oscillators for High Volume Commercial Applications
Author :
Lutz, M. ; Partridge, A. ; Gupta, P. ; Buchan, N. ; Klaassen, E. ; McDonald, J. ; Petersen, K.
Author_Institution :
SiTime Corp., Sunnyvale
Abstract :
Microelectromechanical systems (MEMS) resonators have been investigated for over forty years but have never delivered the high performance and low cost required of commercial oscillators. Limiting factors have been temperature drift, long term stability, susceptibility to vibration, manufacturability, and low cost back-end packaging. These requirements have now been met by SiTime´s MEMS FirstTM wafer-level encapsulation technology combined with a system architecture using modern phase lock loop (PLL) technology with a high performance CMOS signal conditioning chip. SiTime´s MEMS and CMOS chips are manufactured in state of the art CMOS fabrication facilities and can be packaged with any semiconductor packaging technology. The resulting silicon MEMS oscillators outperform existing quartz solutions in various aspects such as reliability, robustness, small size, and system integration.
Keywords :
elemental semiconductors; encapsulation; micromechanical resonators; oscillators; phase locked loops; semiconductor device packaging; CMOS signal conditioning chip; MEMS First wafer-level encapsulation technology; high volume commercial applications; microelectromechanical systems resonators; modern phase lock loop; semiconductor packaging technology; silicon MEMS oscillators; CMOS technology; Costs; Manufacturing; Microelectromechanical systems; Micromechanical devices; Oscillators; Semiconductor device packaging; Stability; Temperature; Wafer scale integration; high volume manufacturing; oscillator; reliability; resonator; wafer level packaging;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
DOI :
10.1109/SENSOR.2007.4300068