• DocumentCode
    3371104
  • Title

    MEMS Oscillators for High Volume Commercial Applications

  • Author

    Lutz, M. ; Partridge, A. ; Gupta, P. ; Buchan, N. ; Klaassen, E. ; McDonald, J. ; Petersen, K.

  • Author_Institution
    SiTime Corp., Sunnyvale
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    49
  • Lastpage
    52
  • Abstract
    Microelectromechanical systems (MEMS) resonators have been investigated for over forty years but have never delivered the high performance and low cost required of commercial oscillators. Limiting factors have been temperature drift, long term stability, susceptibility to vibration, manufacturability, and low cost back-end packaging. These requirements have now been met by SiTime´s MEMS FirstTM wafer-level encapsulation technology combined with a system architecture using modern phase lock loop (PLL) technology with a high performance CMOS signal conditioning chip. SiTime´s MEMS and CMOS chips are manufactured in state of the art CMOS fabrication facilities and can be packaged with any semiconductor packaging technology. The resulting silicon MEMS oscillators outperform existing quartz solutions in various aspects such as reliability, robustness, small size, and system integration.
  • Keywords
    elemental semiconductors; encapsulation; micromechanical resonators; oscillators; phase locked loops; semiconductor device packaging; CMOS signal conditioning chip; MEMS First wafer-level encapsulation technology; high volume commercial applications; microelectromechanical systems resonators; modern phase lock loop; semiconductor packaging technology; silicon MEMS oscillators; CMOS technology; Costs; Manufacturing; Microelectromechanical systems; Micromechanical devices; Oscillators; Semiconductor device packaging; Stability; Temperature; Wafer scale integration; high volume manufacturing; oscillator; reliability; resonator; wafer level packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300068
  • Filename
    4300068