Title :
Monitoring and reconfiguration techniques for power supply variation tolerant on-chip links
Author :
Nigussie, Ethiopia ; Plosila, Juha ; Isoaho, Jouni
Author_Institution :
Dept. of Inf. Technol., Univ. of Turku, Turku, Finland
fDate :
May 30 2010-June 2 2010
Abstract :
We present a runtime power supply and temperature variation tolerance technique for delay-insensitive on-chip communication links. Signal integrity of a current sensing receiver is affected by runtime supply voltage and temperature fluctuations. By monitoring receiver´s input current and comparing it with receiver´s reference current, the effect of variation on link reliability is detected. Receiver reconfiguration and request for retransmission is carried out when error is detected. This scheme makes the link adaptive to the effect of variations enabling continuous and reliable operation of the link. The power consumption due to monitoring is 489μW for a 2mm link, which is 1.63% of a 64-bit l-of-4 encoded link´s power consumption. It requires only 5.83um additional active area. The circuits are designed and simulated in Cadence Analog Spectre using 65nm CMOS technology from STMicroelectronics.
Keywords :
CMOS integrated circuits; microprocessor chips; power consumption; power supply circuits; receivers; 64-bit l-of-4 encoded link; CMOS technology; Cadence analog spectre; STMicroelectronics; current sensing receiver; delay-insensitive on-chip communication links; link reliability; power 489 muW; power consumption; receivers input current; receivers reference current; runtime power supply; signal integrity; size 65 nm; temperature fluctuations; temperature variation tolerance technique; tolerant on-chip links; CMOS analog integrated circuits; CMOS technology; Circuit simulation; Delay; Energy consumption; Monitoring; Power supplies; Runtime; Temperature sensors; Voltage fluctuations;
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
DOI :
10.1109/ISCAS.2010.5536967