DocumentCode :
3371685
Title :
Implant isolation for lattice matched InGaAs/InAlAs/InP modulation doped field effect transistor realisation
Author :
Fourre, H. ; Schuler, O. ; Pesant, J.C. ; Leroy, A. ; Cappy, A.
Author_Institution :
Dept. Hyperfrequences et Semi-conducteurs, CNRS, Villeneuve d´´Ascq, France
fYear :
1996
fDate :
21-25 Apr 1996
Firstpage :
331
Lastpage :
333
Abstract :
We have investigated implant isolation for lattice matched InGaAs/InAlAs/InP Modulation Doped Field Effect Transistors (MODFETs). The sheet resistances of the MODFET layers were measured after implantation of different ions species (H+, B+, F + and Ar+), for different ion doses (1012 -1015 cm-2) and after post implant annealing (100°C-400°C) for different annealing time (10 min-24 h). The best measured sheet resistance was about 30 MΩ/□ using Ar + implantation with a dose of 1.1015 cm-2 and 10 hours annealing at 300°C. This is the best implant isolation result obtained for InP lattice matched MODFET layer to our knowledge. This result allows us to realise planar InP lattice matched MODFET with a good isolation
Keywords :
III-V semiconductors; aluminium compounds; annealing; gallium arsenide; high electron mobility transistors; indium compounds; ion implantation; isolation technology; 10 hr; 10 min to 24 hr; 100 to 400 C; 300 C; Ar+ implantation; HEMT; InGaAs-InAlAs-InP; field effect transistor; implant isolation; ion doses; ions species; lattice matched MODFET; modulation doped FET; planar MODFET; post implant annealing; sheet resistances; Annealing; Argon; Electrical resistance measurement; HEMTs; Implants; Indium compounds; Indium gallium arsenide; Indium phosphide; Lattices; MODFETs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials, 1996. IPRM '96., Eighth International Conference on
Conference_Location :
Schwabisch-Gmund
Print_ISBN :
0-7803-3283-0
Type :
conf
DOI :
10.1109/ICIPRM.1996.492046
Filename :
492046
Link To Document :
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