Relation between yield and reliability of integrated circuits: experimental results and application to continuous early failure rate reduction programs

Author

Kuper, Fred ; Van der Pol, Jacob ; Ooms, Eric ; Johnson, Tim ; Wijburg, Rutger ; Koster, Willem ; Johnston, Dave

Author_Institution

Philips Semicond., Nijmegen, Netherlands

fYear

1996

fDate

April 30 1996-May 2 1996

Firstpage

17

Lastpage

21

Abstract

The relation between yield and early failures as encountered in the field was investigated with several high volume IC´s manufactured in several processes. A clear correlation between yield and reliability was found that obeys a simple model. The model also provides the ability to predict the FIT or PPM level of a given IC based on its yield. Using these results we illustrate how a wafer fab may improve the reliability level of its products in a controlled way.

Keywords

failure analysis; integrated circuit reliability; integrated circuit yield; FIT level; IC manufacture; IC reliability; IC yield; PPM level; continuous early failure rate reduction programs; early failures; high volume ICs; integrated circuits; model; wafer fab reliability level improvement; Application specific integrated circuits; Circuit testing; Failure analysis; Integrated circuit modeling; Integrated circuit reliability; Integrated circuit yield; Jacobian matrices; Life testing; Product design; Semiconductor device modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1996. 34th Annual Proceedings., IEEE International

Conference_Location

Dallas, TX, USA

Print_ISBN

0-7803-2753-5

Type

conf

DOI

10.1109/RELPHY.1996.492055

Filename

492055