Title :
Live demonstration: Inductive power and telemetry for micro-implant
Author_Institution :
Univ. of Oslo, Oslo, Norway
fDate :
May 30 2010-June 2 2010
Abstract :
A prototype for a wireless implantable sensor system is demonstrated intended for a pill sized micro-implant for blood sugar monitoring. Power is sent and telemetry data received over a near field inductive link. The implant system is almost completely realized on a single CMOS ASIC, excepting three surface mounted capacitors, the coil antenna and the sensor. For this demonstration, the ASIC is packaged and mounted with the 4 other components on a PCB, and the glucose sensor is substituted with either a potentiometer or an atmospheric pressure sensor. In the targeted highly miniaturized implantable micro system all components (including antenna and sensor) will be integrated into a pill sized LTCC (low temperature cofired ceramics) package. The total implant power budget with the minimal supply voltage of 2.5V is at 76μW. This number includes the power for various test structures that will be unnecessary for an industrial prototype, which is expected to operate below 20μW. A simple demonstrator of the reader is implemented on another PCB with a two digit hexadecimal LED display to show the telemetry data.
Keywords :
CMOS integrated circuits; LED displays; antennas; application specific integrated circuits; biochemistry; biomedical electronics; biomedical telemetry; blood; capacitors; ceramic packaging; microsensors; patient monitoring; potentiometers; pressure sensors; printed circuits; prosthetics; CMOS ASIC; PCB; atmospheric pressure sensor; blood sugar monitoring; coil antenna; glucose sensor; inductive power; near field inductive link; pill sized LTCC package; pill sized low temperature cofired ceramic package; pill sized micro-implant; potentiometer; power 76 muW; surface mounted capacitors; telemetry; two digit hexadecimal LED display; voltage 2.5 V; wireless implantable sensor system; Application specific integrated circuits; Biomedical monitoring; Biosensors; Implants; Packaging; Prototypes; Sensor systems; Telemetry; Temperature sensors; Wireless sensor networks;
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
DOI :
10.1109/ISCAS.2010.5537016