DocumentCode
3372080
Title
3D Silicon Betavoltaics Microfabricated using a Self-Aligned Process for 5 Milliwatt/CC Average, 5 Year Lifetime Microbatteries
Author
Duggirala, Rajesh ; Tin, Steven ; Lal, Amit
Author_Institution
Cornell Univ., Ithaca
fYear
2007
fDate
10-14 June 2007
Firstpage
279
Lastpage
282
Abstract
We report on the first demonstration of high efficiency 3D silicon betavoltaics, microtextured with deep reactive ion etched (DRIE) trenches, for potential application in 5 year lifetime 5 mW / cc Promethium -147 powered microbatteries. Prototype 3D silicon betavoltaics were designed and microfabricated in a 2-mask self-aligned process, and characterized using accelerated electron beams in a scanning electron microscope to yield 1.02 % conversion efficiency @ 30 kV acceleration voltage.
Keywords
cells (electric); micromechanical devices; sputter etching; 3D silicon betavoltaics microfabrication; deep reactive ion etched trenches; microbatteries; self-aligned process; Acceleration; Batteries; Electron beams; Etching; Fuels; Pacemakers; Radioactive materials; Silicon; Solid state circuits; Wireless sensor networks; 3D Betavoltaic; Microbattery; Promethium-147; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location
Lyon
Print_ISBN
1-4244-0842-3
Electronic_ISBN
1-4244-0842-3
Type
conf
DOI
10.1109/SENSOR.2007.4300123
Filename
4300123
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