Title :
Non-Destructive Functionality and Reliability Assessment of Dynamic MEMS using Acoustic Phonon Characterization
Author :
Wong, Wai-Kin ; Wong, Chee-Leong ; Palaniapan, Moorthi ; Tay, Francis Eng Hock
Author_Institution :
Nat. Univ. of Singapore, Singapore
Abstract :
This paper introduces a novel technique for dynamic motion characterization of microelectromechanical (MEMS) devices such as resonators, switches, micromirrors, accelerometers and gyroscopes. Due to the favorable generation and transmission of acoustic phonons through solids, characterization of individual MEMS devices for both dies and packaged devices can be attained non- invasively. Hence, this technique can be utilized for high volume wafer and package-level testing in MEMS manufacturing, allowing new test functionalities and cost economies in back-end wafer and package yield screens to be attained.
Keywords :
acoustic devices; micromechanical devices; nondestructive testing; phonons; acoustic phonon characterization; dynamic motion characterization; microelectromechanical device; nondestructive functionality; package-level testing; reliability assessment; Accelerometers; Acoustic devices; Acoustic testing; Character generation; Gyroscopes; Micromechanical devices; Micromirrors; Packaging; Phonons; Switches; Acoustic phonons; RF switches; SEM; non-destructive testing; resonators;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
DOI :
10.1109/SENSOR.2007.4300145
