Non-Destructive Functionality and Reliability Assessment of Dynamic MEMS using Acoustic Phonon Characterization

This paper introduces a novel technique for dynamic motion characterization of microelectromechanical (MEMS) devices such as resonators, switches, micromirrors, accelerometers and gyroscopes. Due to the favorable generation and transmission of acoustic phonons through solids, characterization of individual MEMS devices for both dies and packaged devices can be attained non- invasively. Hence, this technique can be utilized for high volume wafer and package-level testing in MEMS manufacturing, allowing new test functionalities and cost economies in back-end wafer and package yield screens to be attained.