Title :
A microchip electrochemical immunosensor fabricated using micromachining techniques
Author :
Choi, Jin-Woo ; Ding, Ying ; Ahn, Chong H. ; Halsall, H. Brian ; Heineman, William R.
Author_Institution :
Center for Microelectron. Sensors & MEMS, Cincinnati Univ., OH, USA
Abstract :
Using micromachining techniques, an electrochemical immunosensor has been designed, fabricated and tested on a Pyrex glass wafer. The sensor has an electrochemical cell that is composed of a reference, an auxiliary and two working electrodes on a spin-coated polyimide film, where the reference electrode is silver and the others are platinum. The polyimide film is used for antibody immobilization instead of a polystyrene sheet which is usually used in conventional immunosensors. A reaction chamber is fabricated separately on a silicon wafer using anisotropic etching techniques. The electrochemical cell on a glass wafer and the reaction chamber on a silicon wafer are then bonded together to construct the immunosensor using polymer bonding techniques. Fabricated immunosensors are tested by the method of cyclic voltammetry (CV) before analyzing the antigen-antibody reaction. Test antibodies are well attached to the polyimide substrate, and the results of the CV test shows that this immunosensor can be successfully applied for electrochemical immunoassay
Keywords :
biosensors; electrochemical sensors; etching; intelligent sensors; microfluidics; micromachining; microsensors; voltammetry (chemical analysis); Pyrex glass wafer; Si; anisotropic etching; antibody immobilization; antigen-antibody reaction; cyclic voltammetry; electrochemical cell; microchip electrochemical immunosensor; microfluidic system; micromachining; reaction chamber; silicon wafer; smart immunosensor; spin-coated polyimide film; Anisotropic magnetoresistance; Electrodes; Glass; Micromachining; Platinum; Polyimides; Silicon; Silver; Testing; Wafer bonding;
Conference_Titel :
Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-4262-3
DOI :
10.1109/IEMBS.1997.758812