Title :
Failure analysis on multilayer ceramic capacitor (MLCC) with leakage failure caused by silver (Ag) migration in molded plastic package
Author :
Ng, K.K. ; Rajaratnam, M.
Author_Institution :
Infineon Technol. (Malaysia) Sdn Bhd, Batu Berendam, Malaysia
Abstract :
Various analysis techniques inclusive cross section, parallel grinding, package decapsulation, SEM and EDX had been performed to determine the cause of high leakage on MLCC samples. At the end, analysis method combining the mechanical cracking and laser ablation was successfully pin point the failure was due to Ag migration at the external package of MLCC.
Keywords :
ceramic capacitors; cracks; electronics packaging; failure analysis; laser ablation; plastic packaging; EDX; SEM; failure analysis; inclusive cross section; laser ablation; leakage failure; mechanical cracking; molded plastic package; multilayer ceramic capacitor; package decapsulation; parallel grinding; silver migration; Capacitors; Ceramics; Chemicals; Compounds; Lapping; Performance evaluation; Silver;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0980-6
DOI :
10.1109/IPFA.2012.6306260
