• DocumentCode
    3372838
  • Title

    Event-based recognition and source identification of transient tailbacks in manufacturing plants

  • Author

    Schwenke, Clemens ; Wagner, Thomas ; Gellrich, Andre ; Kabitzsch, Klaus

  • Author_Institution
    Inst. of Appl. Comput. Sci., Dresden Univ. of Technol., Dresden, Germany
  • fYear
    2012
  • fDate
    9-12 Dec. 2012
  • Firstpage
    1
  • Lastpage
    12
  • Abstract
    Automated material handling systems in complex manufacturing plants oftentimes exhibit, possibly transient, tailback phenomena, which reduce a production line´s throughput. In order to identify origins and causes of observed tailbacks, historic event log data of loads passing certain waypoints has to be inspected. This paper introduces an approach to automatically carry out transient tailback recognition and cause identification. The approach is based on analysis of holding times and capacities of transport segments. As a result, complete lists of tailbacks and affected segments are provided. Each tailback consists of a reconstructed queue of loads waiting for preceding loads. For each tailback an initial cause event is determined. Additionally, identified tailbacks can be ranked by length or by impact on the transport delays. The developed demonstrator frees the user from time consuming visual inspection of log files by providing clearly represented complete tailback information instead.
  • Keywords
    cause-effect analysis; data analysis; identification; industrial plants; inspection; materials handling equipment; pattern recognition; production engineering computing; transportation; automated material handling systems; cause identification; complex manufacturing plants; event-based recognition; historic event log data; holding times analysis; initial cause event; inspection; preceding loads; production line throughput; source identification; tailback information; transient tailback recognition; transport delays; transport segment capacities; Analytical models; Buildings; Data models; Load modeling; Manufacturing; Semiconductor device modeling; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), Proceedings of the 2012 Winter
  • Conference_Location
    Berlin
  • ISSN
    0891-7736
  • Print_ISBN
    978-1-4673-4779-2
  • Electronic_ISBN
    0891-7736
  • Type

    conf

  • DOI
    10.1109/WSC.2012.6465013
  • Filename
    6465013