• DocumentCode
    3373060
  • Title

    Improved luminescence efficiency of InAs quantum dots by nitrogen-induced strain compensation with GaNAs burying layers

  • Author

    Suemune, Ikuo ; Ganapathy, Shrikanth ; Kumano, Hidekazu ; Uesugi, K.

  • Author_Institution
    Res. Inst. for Electron. Sci., Hokkaido Univ., Sapporo, Japan
  • fYear
    2004
  • fDate
    31 May-4 June 2004
  • Firstpage
    636
  • Lastpage
    639
  • Abstract
    Luminescence efficiency of InAs quantum dots (QDs) was shown to improve with strain compensation of the compressive strain in InAs QDs with tensile-strained GaNAs burying layers. The improved luminescence efficiency is discussed with the viewpoint of the average strain compensation in the strained semiconductor system. The red shift of the luminescence peak up to 1.55 μm is also discussed from the same viewpoint of the strain compensation. The valence-force field model calculation of the strain field in the InAs QDs buried with the GaNAs strain compensating layer shows that the strain induced by nitrogen (N) atoms is significant and localized to respective N atoms and the more detailed information how the N atoms are incorporated during the burying process of the QDs with the GaNAs layers is necessary for the full description.
  • Keywords
    III-V semiconductors; compensation; compressive strength; gallium compounds; indium compounds; photoluminescence; red shift; semiconductor quantum dots; tensile strength; GaNAs; InAs; compressive strain; luminescence efficiency; nitrogen-induced strain compensation; quantum dots; red shift; strained semiconductor system; tensile-strained burying layers; valence-force field model calculation; Atomic layer deposition; Capacitive sensors; Gallium arsenide; Intrusion detection; Luminescence; Molecular beam epitaxial growth; Quantum dots; Substrates; Tensile strain; US Department of Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 2004. 16th IPRM. 2004 International Conference on
  • ISSN
    1092-8669
  • Print_ISBN
    0-7803-8595-0
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2004.1442805
  • Filename
    1442805