• DocumentCode
    3373352
  • Title

    In-situ high temperature XRD studies and crystallization behavior of a Ti-rich Ti-Ni-Cu ribbon

  • Author

    Wenjun He ; Guanghui Min ; Tolochko, O.

  • Author_Institution
    Key Lab. for Liquid-Solid Struct. Evolution & Process. of Mater. (Minist. of Educ.), Shandong Univ., Ji´nan, China
  • Volume
    9
  • fYear
    2011
  • fDate
    12-14 Aug. 2011
  • Firstpage
    4732
  • Lastpage
    4736
  • Abstract
    Structure evolution and crystallization behavior of initially amorphous Ti52Ni23Cu25 alloy ribbon were investigated by means of in-situ high temperature X-ray diffraction and DSC. The structure of crystallization products and the texture of B2 phase vary with annealing temperature increasing from 350 to 650°C. B2 crystalline phase was formed initially at 400°C from the amorphous ribbon, while a Ti2(Ni+Cu) type of precipitates were developed at the temperature above 550 °C. The texture of B2 phase has a transition from B2-(200) to B2-(011), and then keeps stable as the annealing temperature increases. Continuous DSC measurements with different heating rates were performed to determine crystallization activation energy and Avrami exponent for the alloy ribbon. The activation energy determined by Kissinger´s equation was 372kJ/mol. The Avrami exponent values (n=2) obtained from the basis analysis of Johnson-Mehl-Avrami equation are consistent with diffusion controlled crystallization processes with decreasing nucleation rate.
  • Keywords
    X-ray diffraction; amorphous state; annealing; copper alloys; crystallisation; differential scanning calorimetry; diffusion; high-temperature effects; nickel alloys; nucleation; precipitation (physical chemistry); texture; titanium alloys; B2-(200) B2-(011) phase transition; DSC; Johnson-Mehl-Avrami equation; Kissinger equation; Ti-rich ribbon; TiNiCu; X-ray diffraction; activation energy; amorphous alloy ribbon; annealing temperature; crystallization; diffusion; heating rates; in-situ high temperature XRD; nucleation; precipitates; structural evolution; temperature 350 degC to 650 degC; texture; Annealing; Copper; Crystallization; Heating; Temperature measurement; X-ray scattering; Crystallization; Differential scanning calorimetry; Melt-spun ribbon; Ti-Ni-Cu alloy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
  • Conference_Location
    Harbin, Heilongjiang
  • Print_ISBN
    978-1-61284-087-1
  • Type

    conf

  • DOI
    10.1109/EMEIT.2011.6024093
  • Filename
    6024093