DocumentCode :
3373446
Title :
Gate oxide thickness dependence of RIE-induced damages on n-channel MOSFET reliability
Author :
Joshi, A.B. ; Chung, L. ; Min, B.W. ; Kwong, D.L.
Author_Institution :
Rockwell Semicond. Syst., Newport Beach, CA, USA
fYear :
1996
fDate :
April 30 1996-May 2 1996
Firstpage :
300
Lastpage :
304
Abstract :
We have investigated the effect of gate oxide thickness scaling on RIE-induced damage in n-MOSFETs. Our results show that active damage to gate oxide increases as the thickness is scaled down. On the other hand, thinner gate oxide devices show smaller degradation under hot carrier as well as Fowler-Nordheim stress compared to thicker gate oxide devices for a given antenna type and ratio. Reduced degradation in thinner oxide MOSFETs is explained based on smaller mobility degradation as well as on higher amount of channel inversion charge.
Keywords :
MOSFET; carrier mobility; dielectric thin films; hot carriers; semiconductor device reliability; sputter etching; Fowler-Nordheim stress; NMOSFET reliability; RIE-induced damage; channel inversion charge; gate oxide thickness dependence; hot carrier stress; mobility degradation; n-channel MOSFET; oxide thickness scaling; Degradation; Hot carriers; MOSFET circuits; Plasma devices; Plasma materials processing; Plasma properties; Plasma sources; Semiconductor device reliability; Silicon; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1996. 34th Annual Proceedings., IEEE International
Conference_Location :
Dallas, TX, USA
Print_ISBN :
0-7803-2753-5
Type :
conf
DOI :
10.1109/RELPHY.1996.492134
Filename :
492134
Link To Document :
بازگشت