• DocumentCode
    3373559
  • Title

    Control of plasma induced fluorine damage in P-HEMT using InSb barrier layer

  • Author

    Uchiyama, H. ; Taniguchi, T. ; Kudo, M.

  • Author_Institution
    Central Res. Lab., Hitachi Ltd., Tokyo, Japan
  • fYear
    2004
  • fDate
    31 May-4 June 2004
  • Firstpage
    727
  • Lastpage
    730
  • Abstract
    We investigated plasma induced fluorine damage in P-HEMT by C2F6/CHF3 RIE and found that fluorine atoms penetrated to the channel layer. We also found these fluorine atoms were apt to stack on a strained interface, like Si-planar doped layer and hetero interfaces, by thermal annealing. Utilizing the properties of fluorine atoms, we improved a P-HEMT structure that had an ultra thin InSb strained barrier layer above the Si-planar doped layer. The InSb barrier layer effectively absorbed the intruded fluorine atoms in P-HEMT, and the degradation in the carrier density and mobility was suppressed much more than that of conventional P-HEMT structure.
  • Keywords
    III-V semiconductors; annealing; carrier density; carrier mobility; fluorine; high electron mobility transistors; indium compounds; sputter etching; InSb; P-HEMT; RIE; barrier layer; carrier density; carrier mobility; channel layer; heterointerfaces; plasma induced fluorine damage; strained interface; thermal annealing; Annealing; Atomic layer deposition; Charge carrier density; Dry etching; Gallium arsenide; Plasma applications; Plasma density; Plasma stability; Radio frequency; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 2004. 16th IPRM. 2004 International Conference on
  • ISSN
    1092-8669
  • Print_ISBN
    0-7803-8595-0
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2004.1442828
  • Filename
    1442828