DocumentCode :
3373559
Title :
Control of plasma induced fluorine damage in P-HEMT using InSb barrier layer
Author :
Uchiyama, H. ; Taniguchi, T. ; Kudo, M.
Author_Institution :
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
fYear :
2004
fDate :
31 May-4 June 2004
Firstpage :
727
Lastpage :
730
Abstract :
We investigated plasma induced fluorine damage in P-HEMT by C2F6/CHF3 RIE and found that fluorine atoms penetrated to the channel layer. We also found these fluorine atoms were apt to stack on a strained interface, like Si-planar doped layer and hetero interfaces, by thermal annealing. Utilizing the properties of fluorine atoms, we improved a P-HEMT structure that had an ultra thin InSb strained barrier layer above the Si-planar doped layer. The InSb barrier layer effectively absorbed the intruded fluorine atoms in P-HEMT, and the degradation in the carrier density and mobility was suppressed much more than that of conventional P-HEMT structure.
Keywords :
III-V semiconductors; annealing; carrier density; carrier mobility; fluorine; high electron mobility transistors; indium compounds; sputter etching; InSb; P-HEMT; RIE; barrier layer; carrier density; carrier mobility; channel layer; heterointerfaces; plasma induced fluorine damage; strained interface; thermal annealing; Annealing; Atomic layer deposition; Charge carrier density; Dry etching; Gallium arsenide; Plasma applications; Plasma density; Plasma stability; Radio frequency; Thermal degradation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials, 2004. 16th IPRM. 2004 International Conference on
ISSN :
1092-8669
Print_ISBN :
0-7803-8595-0
Type :
conf
DOI :
10.1109/ICIPRM.2004.1442828
Filename :
1442828
Link To Document :
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