• DocumentCode
    3373822
  • Title

    An Industrial Case Study of Sticky Path-Delay Faults

  • Author

    Huang, I-De ; Chang, Yi-Shing ; Gupta, Sandeep K. ; Chakravarty, Sreejit

  • Author_Institution
    Intel Corp., Folsom, CA
  • fYear
    2008
  • fDate
    April 27 2008-May 1 2008
  • Firstpage
    395
  • Lastpage
    402
  • Abstract
    Sticky path-delay faults are path delay faults that are neither robustly nor non-robustly testable, but cannot be proven functionally unsensitizable. Better characterization of delay test quality requires a proper analysis of sticky path-delay faults. Furthermore, careful elimination of sticky path-delay faults contributes significantly to test development productivity and reduction of delay test cost. We present an industrial case study that shows the following, (a) On average, even after designers have removed false paths using automated tools and manual overrides, about 8% of path-delay faults with slack less than 10% of the clock period can be sticky, (b) Our approach, which extends a previously proposed technique, identifies a large subset of sticky path-delay faults that cannot cause functional failures and hence can be eliminated from further consideration. This significantly refines the delay test quality assessment and test development effort, (c) Our approach significantly reprioritizes (reorders) the remaining paths for test generation thereby improving the quality of the target path list.
  • Keywords
    automatic test pattern generation; delays; fault diagnosis; integrated circuit testing; automated tools; delay test quality; false paths; sticky path-delay faults; test generation; Automatic test pattern generation; Circuit faults; Circuit testing; Clocks; Delay; Fabrication; Robustness; System testing; Timing; Very large scale integration; delay testing; path reprioritization; sticky paths; test quality; timing false paths;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium, 2008. VTS 2008. 26th IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1093-0167
  • Print_ISBN
    978-0-7695-3123-6
  • Type

    conf

  • DOI
    10.1109/VTS.2008.44
  • Filename
    4511757