• DocumentCode
    3373875
  • Title

    Design and Fabrication of a Laterally Driven Bistable Electromagnetic Microrelay

  • Author

    Hwang, S.J. ; Lee, M.G. ; Jung, P.G. ; Kim, J.H. ; Oh, D.J. ; Go, J.S. ; Shin, B. ; Ko, J.S.

  • Author_Institution
    Pusan Nat. Univ., Pusan
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    671
  • Lastpage
    674
  • Abstract
    A laterally driven bistable electromagnetic microrelay has been designed, fabricated, and tested. The working principle of the proposed microrelay is based on the Fleming´s left hand rule. Silicon-on-insulator wafers are used for electrical isolation and releasing of the moving microstructures. The high-aspect-ratio microstructures are fabricated using a DRIE process. The tandem-typed arch- shaped leaf springs with a silicon/gold composite layer enhance the mechanical performances while reducing the electrical resistance. A permanent magnet is attached at the bottom of the silicon substrate, resulting in the generation of an external magnetic field in the vertical direction of the silicon substrate. The leaf springs show a bistable behavior. The resistance of the pair of leaf springs was 5.5Omega and the contact resistance was 4.7Omega. The driving voltage is measured to be plusmn0.5 V.
  • Keywords
    electromagnetic devices; microrelays; permanent magnets; silicon-on-insulator; sputter etching; substrates; DRIE process; electrical isolation; electrical resistance; high-aspect-ratio microstructures; laterally driven bistable electromagnetic microrelay; permanent magnet; silicon substrate; silicon-on-insulator wafers; tandem-typed arch- shaped leaf springs; Contact resistance; Electric resistance; Fabrication; Gold; Magnetic field measurement; Microrelays; Microstructure; Silicon on insulator technology; Springs; Testing; Lorenz force; bistable; electromagnetic; microrelay;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300219
  • Filename
    4300219