DocumentCode
3373941
Title
Developing functional Prototypes by package modification using plasma FIB technology
Author
Gonzales, Michael ; Cruz, Roddy ; Parley, Martin ; Lau, Jonathan ; DiBattista, Michael ; Routh, Bryan, Jr. ; Landin, Trevan ; Carleson, Peter ; Huggins, Ebb ; Mani, Kenny
Author_Institution
Qualcomm Inc., San Diego, CA, USA
fYear
2012
fDate
2-6 July 2012
Firstpage
1
Lastpage
5
Abstract
Packaging technology plays a key role in the performance of many analog and RF circuits. Due to the size and geometries of interconnects, FIB based circuit edit has not been practical on the package. Plasma FIB (PFIB) technology allows cuts and rewiring in the package substrate to create fully testable prototypes.
Keywords
integrated circuit packaging; FIB based circuit edit; RF circuits; functional prototypes; package modification; package substrate; packaging technology; plasma FIB technology; Copper; Integrated circuit interconnections; Plasmas; Prototypes; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location
Singapore
ISSN
1946-1542
Print_ISBN
978-1-4673-0980-6
Type
conf
DOI
10.1109/IPFA.2012.6306324
Filename
6306324
Link To Document