DocumentCode
3374010
Title
Optimized inspection capacity for out of control detection in semiconductor manufacturing
Author
Tirkel, Israel
Author_Institution
Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
fYear
2012
fDate
9-12 Dec. 2012
Firstpage
1
Lastpage
8
Abstract
In-line inspection is designated to detect out-of-control (OOC) performance in order to increase quality output, and thus profit. Since inspection capacity is costly, it raises the question of how much capacity should be acquired to minimize OOC. Clearly, lower OOC requires higher capacity. This paper suggests a model that optimizes inspection capacity and OOC tradeoff. It is based on a typical process step monitored by an inspection facility. Processed items are sampled and inspected, considering inspection rate and response time, in order to minimize OOC rate at a given capacity. The inspection operating curve is established for demonstrating the tradeoff between OOC rate and inspection capacity. It exhibits that OOC decreases at a reduced rate with increasing capacity. Fab specific financials can provide the cost ratio between capacity and OOC for determining the preferred working point on the inspection operating curve.
Keywords
inspection; quality management; semiconductor device manufacture; OOC tradeoff; in-line inspection; inspection operating curve; inspection rate; optimized inspection capacity; out-of-control detection; response time; semiconductor manufacturing; Fabrication; Inspection; Integrated circuits; Production systems; Semiconductor device measurement; Semiconductor device modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference (WSC), Proceedings of the 2012 Winter
Conference_Location
Berlin
ISSN
0891-7736
Print_ISBN
978-1-4673-4779-2
Electronic_ISBN
0891-7736
Type
conf
DOI
10.1109/WSC.2012.6465071
Filename
6465071
Link To Document