DocumentCode :
3374010
Title :
Optimized inspection capacity for out of control detection in semiconductor manufacturing
Author :
Tirkel, Israel
Author_Institution :
Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
fYear :
2012
fDate :
9-12 Dec. 2012
Firstpage :
1
Lastpage :
8
Abstract :
In-line inspection is designated to detect out-of-control (OOC) performance in order to increase quality output, and thus profit. Since inspection capacity is costly, it raises the question of how much capacity should be acquired to minimize OOC. Clearly, lower OOC requires higher capacity. This paper suggests a model that optimizes inspection capacity and OOC tradeoff. It is based on a typical process step monitored by an inspection facility. Processed items are sampled and inspected, considering inspection rate and response time, in order to minimize OOC rate at a given capacity. The inspection operating curve is established for demonstrating the tradeoff between OOC rate and inspection capacity. It exhibits that OOC decreases at a reduced rate with increasing capacity. Fab specific financials can provide the cost ratio between capacity and OOC for determining the preferred working point on the inspection operating curve.
Keywords :
inspection; quality management; semiconductor device manufacture; OOC tradeoff; in-line inspection; inspection operating curve; inspection rate; optimized inspection capacity; out-of-control detection; response time; semiconductor manufacturing; Fabrication; Inspection; Integrated circuits; Production systems; Semiconductor device measurement; Semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference (WSC), Proceedings of the 2012 Winter
Conference_Location :
Berlin
ISSN :
0891-7736
Print_ISBN :
978-1-4673-4779-2
Electronic_ISBN :
0891-7736
Type :
conf
DOI :
10.1109/WSC.2012.6465071
Filename :
6465071
Link To Document :
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