• DocumentCode
    3374010
  • Title

    Optimized inspection capacity for out of control detection in semiconductor manufacturing

  • Author

    Tirkel, Israel

  • Author_Institution
    Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
  • fYear
    2012
  • fDate
    9-12 Dec. 2012
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    In-line inspection is designated to detect out-of-control (OOC) performance in order to increase quality output, and thus profit. Since inspection capacity is costly, it raises the question of how much capacity should be acquired to minimize OOC. Clearly, lower OOC requires higher capacity. This paper suggests a model that optimizes inspection capacity and OOC tradeoff. It is based on a typical process step monitored by an inspection facility. Processed items are sampled and inspected, considering inspection rate and response time, in order to minimize OOC rate at a given capacity. The inspection operating curve is established for demonstrating the tradeoff between OOC rate and inspection capacity. It exhibits that OOC decreases at a reduced rate with increasing capacity. Fab specific financials can provide the cost ratio between capacity and OOC for determining the preferred working point on the inspection operating curve.
  • Keywords
    inspection; quality management; semiconductor device manufacture; OOC tradeoff; in-line inspection; inspection operating curve; inspection rate; optimized inspection capacity; out-of-control detection; response time; semiconductor manufacturing; Fabrication; Inspection; Integrated circuits; Production systems; Semiconductor device measurement; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), Proceedings of the 2012 Winter
  • Conference_Location
    Berlin
  • ISSN
    0891-7736
  • Print_ISBN
    978-1-4673-4779-2
  • Electronic_ISBN
    0891-7736
  • Type

    conf

  • DOI
    10.1109/WSC.2012.6465071
  • Filename
    6465071