DocumentCode
3374069
Title
Proceedings of Electrical Performance of Electronic Packaging
fYear
1995
fDate
2-4 Oct. 1995
Abstract
The following topics were dealt with: system issues in package design; high performance microprocessor packaging and interconnects; simultaneous switching noise; decoupling capacitors; measurement techniques; optical and electrical communication links; wireless communication; microwave packaging; simulation and modelling
Keywords
packaging; decoupling capacitors; electrical communication links; high performance microprocessor packaging; interconnection characterization; measurement techniques; microwave packaging; modelling; optical communication links; package design; simulation; simultaneous switching noise; wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR, USA
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524675
Filename
524675
Link To Document