DocumentCode :
3374069
Title :
Proceedings of Electrical Performance of Electronic Packaging
fYear :
1995
fDate :
2-4 Oct. 1995
Abstract :
The following topics were dealt with: system issues in package design; high performance microprocessor packaging and interconnects; simultaneous switching noise; decoupling capacitors; measurement techniques; optical and electrical communication links; wireless communication; microwave packaging; simulation and modelling
Keywords :
packaging; decoupling capacitors; electrical communication links; high performance microprocessor packaging; interconnection characterization; measurement techniques; microwave packaging; modelling; optical communication links; package design; simulation; simultaneous switching noise; wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR, USA
Print_ISBN :
0-7803-3034-X
Type :
conf
DOI :
10.1109/EPEP.1995.524675
Filename :
524675
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3374069
بازگشت