DocumentCode
3374124
Title
Advanced SEM/SPM microscopy
Author
Heiderhoff, Ralf
Author_Institution
Fac. of Electr., Inf. & Media Eng., Univ. of Wuppertal, Wuppertal, Germany
fYear
2012
fDate
2-6 July 2012
Firstpage
1
Lastpage
4
Abstract
Advanced SEM/SPM microscopy will expand the application fields in failure analysis and reliability investigation, because the recognition of defects and their subsequent characterization have to be carried out with highest spatial resolution to ensure that even smallest structures with modified material properties can be evaluated. Promising for future applications is the fact that the used probes simultaneously can either be used as sensors, giving access to a vast variety of material properties, or as actuators, which can deliberately modify samples properties.
Keywords
failure analysis; scanning electron microscopy; scanning probe microscopy; semiconductor device reliability; advanced SEM/SPM microscopy; failure analysis; reliability investigation; Electron beams; Heating; Probes; Scanning electron microscopy; Thermal analysis; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location
Singapore
ISSN
1946-1542
Print_ISBN
978-1-4673-0980-6
Type
conf
DOI
10.1109/IPFA.2012.6306335
Filename
6306335
Link To Document