• DocumentCode
    3374124
  • Title

    Advanced SEM/SPM microscopy

  • Author

    Heiderhoff, Ralf

  • Author_Institution
    Fac. of Electr., Inf. & Media Eng., Univ. of Wuppertal, Wuppertal, Germany
  • fYear
    2012
  • fDate
    2-6 July 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Advanced SEM/SPM microscopy will expand the application fields in failure analysis and reliability investigation, because the recognition of defects and their subsequent characterization have to be carried out with highest spatial resolution to ensure that even smallest structures with modified material properties can be evaluated. Promising for future applications is the fact that the used probes simultaneously can either be used as sensors, giving access to a vast variety of material properties, or as actuators, which can deliberately modify samples properties.
  • Keywords
    failure analysis; scanning electron microscopy; scanning probe microscopy; semiconductor device reliability; advanced SEM/SPM microscopy; failure analysis; reliability investigation; Electron beams; Heating; Probes; Scanning electron microscopy; Thermal analysis; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
  • Conference_Location
    Singapore
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4673-0980-6
  • Type

    conf

  • DOI
    10.1109/IPFA.2012.6306335
  • Filename
    6306335