DocumentCode :
3374199
Title :
A Novel Device for Fixing Small Objects using Through-Pore Porous Silicon
Author :
Kato, Atsuko ; Uchiumi, Atsushi ; Hayase, Masanori
Author_Institution :
Tokyo Univ. of Sci., Noda
fYear :
2007
fDate :
10-14 June 2007
Firstpage :
731
Lastpage :
734
Abstract :
A novel device that enables fixing small objects at a specified point on a Si substrate was developed. It will be useful if cell or other small objects can be fixed in a row on a chip and drug dosage to the each object can be controlled. By arranging objects in a row, observation will become easy and quick. Amount of drug usage is also expected to be reduced. It is known that mono crystalline Si becomes porous by anodization in a HF solution and through-pore porous Si region can be formed. By making the through-pore porous region on a specified area, objects can be fixed on the specified area by vacuum suction from the back side of the chip. In this study, patterned through-pore porous Si areas were made on a Si chip. It was observed that a polystyrene bead was fixed on a through-pore porous area of 7mum times 7mum.
Keywords :
anodisation; micromechanical devices; silicon; MEMS; anodization; drug dosage; polystyrene bead; porous silicon; vacuum suction; Chemical technology; Conductivity; Drugs; Fuel cells; MONOS devices; Mechanical engineering; Micromechanical devices; Shape control; Silicon; Wet etching; MEMS; anodization; porous Si; vacuum suction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
Type :
conf
DOI :
10.1109/SENSOR.2007.4300234
Filename :
4300234
Link To Document :
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