• DocumentCode
    3374432
  • Title

    Novel charge pumping method without using MOS transistor for SOI wafer inspection

  • Author

    Takami, T. ; Yoshida, H. ; Uchihashi, T. ; Kishino, S.

  • Author_Institution
    Dept. of Electron., Himeji Inst. of Technol., Japan
  • fYear
    2002
  • fDate
    8-11 April 2002
  • Firstpage
    183
  • Lastpage
    187
  • Abstract
    A novel charge pumping method without using MOS transistors is proposed for obtaining a spatial distribution of interface traps in an SOI wafer. The proposed method can be performed without fabrication processes for the source/drain of MOS transistors that are essential for conventional charge pumping methods. In this method, Schottky contacts are used instead of the normal source/drain diffused layer. The results demonstrate that the proposed method is effective in applying to SOI wafer inspection.
  • Keywords
    Schottky barriers; inspection; integrated circuit manufacture; integrated circuit testing; interface states; production testing; silicon-on-insulator; SOI wafer inspection; Schottky contacts; Si; charge pumping method; interface trap density; Charge measurement; Charge pumps; Current measurement; Electrodes; Fabrication; Inspection; MOSFETs; Radiative recombination; Silicon on insulator technology; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2002. ICMTS 2002. Proceedings of the 2002 International Conference on
  • Print_ISBN
    0-7803-7464-9
  • Type

    conf

  • DOI
    10.1109/ICMTS.2002.1193194
  • Filename
    1193194