Automated evaluation of design rules for MCM multilayer wiring systems

When designing wiring systems of multichip modules, simulations have to be performed to avoid laborious and cost-intensive prototyping. To obtain proper design rules for the wiring system, the designer has to find out first what amount of signal reflection, coupling, and attenuation can be tolerated to avoid the possibility of bit errors. In the second step, calculations must show which geometry values such as line width and dielectric thickness are necessary to meet these requirements. To judge the quality of chip-to-chip signal propagation, the author used SPICE simulations, using analog models which were obtained from electromagnetic field simulations using MAFIA (Maxwell Finite Integration Algorithm)