Title :
Technical and economical challenges in microprocessor packaging in the year 2000
Author_Institution :
Intel Corp, Chardler, AZ, USA
Abstract :
Summary form only given. In this paper, we will trace the evolution of the microprocessor and its packaging technologies. It is seen that the packaging of these components have evolved from a passive mechanical enclosure to an active thermal/electrical management platform. Major advances in materials, design, modeling and integration were necessary to meet today´s high-performance microprocessor packaging needs. Problems such as switching noise, EMI emission, power distribution and thermal management will become more aggravated. While multichip modules (MCM) have demonstrated excellent performance capabilities, their usage is hampered by poor economics and a lagging infrastructure
Keywords :
economics; integrated circuit manufacture; integrated circuit packaging; microprocessor chips; technological forecasting; EMI emission; active platform; design; economics; electrical management; integration; materials; microprocessor packaging; modeling; multichip modules; passive mechanical enclosure; power distribution; switching noise; technology; thermal management; Clocks; Costs; Engines; Microprocessors; Packaging; Power generation economics; Silicon; Thermal management; Ultra large scale integration; Very large scale integration;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524681
