• DocumentCode
    3374708
  • Title

    A SAW-based liquid sensor with identification for wireless applications

  • Author

    Hassani, Farid ; Ahmadi, Shahrokh ; Korman, Can ; Zaghloul, Mona

  • Author_Institution
    Dept. of Electr. & Comput. Eng., George Washington Univ., Washington, DC, USA
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    2023
  • Lastpage
    2026
  • Abstract
    The development of a shear horizontal surface acoustic wave (SH-SAW) liquid sensor with identification (ID) for wireless applications is described. Moreover, a novel feature of "write capability" for this sensor is proposed. The SH-SAW passive sensor has a delay line configuration with a sensing area. The sensor is fabricated on a lithium tantalate (LiTaO3) substrate, which is Y-cut with rotations specified between about 36° around the X-axis. The principle of detection is based on the attenuation and time delay between the signals. The sensor is encoded according to partial reflections of an interrogation signal by metal reflectors placed on both side of the interdigital transducers (IDT). The structure of the sensor, the principle of the wireless communication, the detection process and testing results are presented.
  • Keywords
    acoustic delay lines; delays; identification; interdigital transducers; network analysers; surface acoustic waves; LiTaO3; SAW based liquid sensor; SH-SAW passive sensor; delay line configuration; interdigital transducer; network analyzer; partial reflection; shear horizontal surface acoustic wave liquid sensor; signal attenuation; wireless communication; Acoustic sensors; Acoustic waves; Attenuation; Delay effects; Delay lines; Lithium compounds; Reflection; Sensor phenomena and characterization; Surface acoustic waves; Wireless sensor networks; IDT; LiTa03; SH-SAW; liquid sensor; passive sensor; wireless sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537163
  • Filename
    5537163