• DocumentCode
    3375074
  • Title

    Understanding customer returns from a test perspective

  • Author

    Sumikawa, Nik ; Drmanac, Dragoljub Gagi ; Wang, Li.-C. ; Winemberg, LeRoy ; Abadir, Magdy S.

  • Author_Institution
    Univ. of California, Santa Barbara, CA, USA
  • fYear
    2011
  • fDate
    1-5 May 2011
  • Firstpage
    2
  • Lastpage
    7
  • Abstract
    Customer returns are defective parts that pass all functional and parametric tests, but fail in the field. To prevent customer returns, this paper analyzes wafer probe test data and tries to understand what it takes to screen them out during testing. Because these parts pass all tests, analyzing their signatures based on the original test perspective does not make sense. In this work, we search for a novel test perspective where the test signatures from parametric measurements can be used to separate the returned parts from the rest of population. Our study shows that in order to effectively screen customer returns during wafer test, a multivariate screening methodology is desired. This study is based on analyzing over 1000 parametric wafer probe tests and dies from seven lots, each lot containing one returned part. We demonstrate that analyzing customer returns from a multivariate test perspective leads to robust and conservative results.
  • Keywords
    customer satisfaction; inspection; integrated circuit testing; customer return; multivariate screening methodology; parametric measurement; parametric wafer probe tests; test perspective; test signature; wafer probe test data; Algorithm design and analysis; Context; Probes; Semiconductor device measurement; Support vector machines; Testing; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium (VTS), 2011 IEEE 29th
  • Conference_Location
    Dana Point, CA
  • ISSN
    1093-0167
  • Print_ISBN
    978-1-61284-657-6
  • Type

    conf

  • DOI
    10.1109/VTS.2011.5783746
  • Filename
    5783746