DocumentCode
3375074
Title
Understanding customer returns from a test perspective
Author
Sumikawa, Nik ; Drmanac, Dragoljub Gagi ; Wang, Li.-C. ; Winemberg, LeRoy ; Abadir, Magdy S.
Author_Institution
Univ. of California, Santa Barbara, CA, USA
fYear
2011
fDate
1-5 May 2011
Firstpage
2
Lastpage
7
Abstract
Customer returns are defective parts that pass all functional and parametric tests, but fail in the field. To prevent customer returns, this paper analyzes wafer probe test data and tries to understand what it takes to screen them out during testing. Because these parts pass all tests, analyzing their signatures based on the original test perspective does not make sense. In this work, we search for a novel test perspective where the test signatures from parametric measurements can be used to separate the returned parts from the rest of population. Our study shows that in order to effectively screen customer returns during wafer test, a multivariate screening methodology is desired. This study is based on analyzing over 1000 parametric wafer probe tests and dies from seven lots, each lot containing one returned part. We demonstrate that analyzing customer returns from a multivariate test perspective leads to robust and conservative results.
Keywords
customer satisfaction; inspection; integrated circuit testing; customer return; multivariate screening methodology; parametric measurement; parametric wafer probe tests; test perspective; test signature; wafer probe test data; Algorithm design and analysis; Context; Probes; Semiconductor device measurement; Support vector machines; Testing; Vectors;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium (VTS), 2011 IEEE 29th
Conference_Location
Dana Point, CA
ISSN
1093-0167
Print_ISBN
978-1-61284-657-6
Type
conf
DOI
10.1109/VTS.2011.5783746
Filename
5783746
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