• DocumentCode
    3375075
  • Title

    Poly-silicon logic for integration of drive, sense and protection functions in discrete power devices

  • Author

    Wondrak, W. ; Constapel, R. ; Traute, R. ; Bokeloh, Ch ; Herzer, R.

  • Author_Institution
    Daimler-Benz AG, Frankfurt, Germany
  • fYear
    1998
  • fDate
    3-6 Jun 1998
  • Firstpage
    371
  • Lastpage
    374
  • Abstract
    Polysilicon is usually used as a gate material for MOS-gated power devices and can also be used for the fabrication of active components. These components can be integrated on the surface of semiconductor devices, which are dielectrically insulated by a thermal field oxide. This paper describes the application of this technology to a test field of various active and passive devices as well as analog and 15 V elementary logic circuits. It is possible to fabricate analog and digital circuits by including these results in the design process. This therefore provides an inexpensive and easy way to add diagnostic, monitoring and protection functions to power devices, especially high voltage MOSFETs and IGBTs
  • Keywords
    elemental semiconductors; insulated gate bipolar transistors; integrated circuit testing; integrated logic circuits; monitoring; power MOSFET; power bipolar transistors; protection; semiconductor device testing; silicon; 15 V; MOS-gated power devices; Si; active components; active devices; analog circuits; device test field; diagnostic functions; dielectric insulation; digital circuits; discrete power devices; drive/sense/protection function integration; elementary logic circuits; high voltage IGBTs; high voltage MOSFETs; monitoring protection function; passive devices; polysilicon gate material; polysilicon logic; power devices; protection function; semiconductor device surface component integration; thermal field oxide; Circuit testing; Dielectric devices; Dielectric materials; Dielectrics and electrical insulation; Fabrication; Integrated circuit technology; Logic devices; Protection; Semiconductor devices; Semiconductor materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs, 1998. ISPSD 98. Proceedings of the 10th International Symposium on
  • Conference_Location
    Kyoto
  • ISSN
    1063-6854
  • Print_ISBN
    0-7803-4752-8
  • Type

    conf

  • DOI
    10.1109/ISPSD.1998.702719
  • Filename
    702719