• DocumentCode
    3375275
  • Title

    Performance effects of switching noise on CMOS microprocessors

  • Author

    Becker, W.D. ; McCredie, B.D. ; Singh, B. ; Lin, P.

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • fYear
    1995
  • fDate
    2-4 Oct 1995
  • Firstpage
    24
  • Lastpage
    26
  • Abstract
    The simultaneous switching noise of off-chip drivers and internal circuits affect the performance of the CMOS chips. These effects are quantified using voltage waveforms obtained from simulations on a high-frequency package model
  • Keywords
    CMOS digital integrated circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; microprocessor chips; CMOS microprocessors; high-frequency package model; internal circuits; off-chip drivers; simulation; simultaneous switching noise; voltage waveforms; Capacitance; Capacitors; Ceramics; Circuits; Microprocessors; Packaging; Power distribution; Power supplies; Semiconductor device modeling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1995
  • Conference_Location
    Portland, OR
  • Print_ISBN
    0-7803-3034-X
  • Type

    conf

  • DOI
    10.1109/EPEP.1995.524684
  • Filename
    524684
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3375275