DocumentCode

3375965

Title

The following topics are dealt with: post-silicon debug and customer returns; 3D integrated circuit; power issues in test; analog, mixed-signal and RF test/diagnosis; on-chip parametric sensor; delay and performance test; multifaceted approaches for field reliability; advanced methods for leveraging new test standards; memory test and repair; low power integrated circuit test; on-line and system testing; aging, transients and soft errors; solar cells; design for testability; error and fault tolerance; ATPG compression; and reducing test and diagnosis costs.

Keywords

ageing; analogue integrated circuits; automatic test pattern generation; delays; design for testability; integrated circuit reliability; integrated circuit testing; low-power electronics; mixed analogue-digital integrated circuits; radiation hardening (electronics); radiofrequency integrated circuits; semiconductor storage; solar cells; three-dimensional integrated circuits; transients; 3D integrated circuit; ATPG; RF circuit testing; analog circuit testing; customer returns; delay test; design for testability; fault tolerance; field reliability; integrated circuit aging; integrated circuit soft errors; integrated circuit transients; low power integrated circuit test; memory repair; memory test; mixed signal circuit testing; on-chip parametric sensor; on-line testing; performance test; post silicon debug; power issues; solar cells; system testing; test standards;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Test Symposium (VTS), 2011 IEEE 29th

Conference_Location

Dana Point, CA

ISSN

1093-0167

Print_ISBN

978-1-61284-657-6

Type

conf

DOI

10.1109/VTS.2011.5783790

Filename

5783790

Table of contents

conf