DocumentCode :
3376269
Title :
In-Situ Pressure Measurements of Encapsulted Gyroscopes
Author :
Simon, I. ; Billat, S. ; Link, T. ; Nommensen, P. ; Auber, J. ; Manoli, Y.
Author_Institution :
Inst. of Microsystem Technol. (HSG-IMIT), Villingen-Schwenningen
fYear :
2007
fDate :
10-14 June 2007
Firstpage :
1175
Lastpage :
1178
Abstract :
This paper presents new type of test structures based on the Pirani principle. They were realized together with a gyroscope in a 50 mum SOI (silicon-on-insulator)-based technology to measure the encapsulated pressure of Coriolis vibrating gyroscopes (CVG) but might also be adapted to other devices. Design and optimization of the test structures was carried out by an analytical model that accounts for the main technological parameters and enables a good estimate of the precision of the developed test method. The achieved measurement accuracy allows a good separation of encapsulated from non-encapsulated gyroscopes. Further improvements are expected by application of dynamic instead of static test methods.
Keywords :
encapsulation; gyroscopes; integrated circuit testing; pressure measurement; silicon-on-insulator; wafer level packaging; Coriolis vibrating gyroscopes; MEMS-technology; Pirani principle; Si-SiO2; encapsulted gyroscopes; in-situ pressure measurements; nonencapsulated gyroscopes; silicon-on-insulator based technology; size 50 mum; test structure design; test structure optimization; wafer level test; Damping; Gyroscopes; Pressure measurement; Sensor phenomena and characterization; Temperature dependence; Temperature sensors; Testing; Thermal conductivity; Thermal sensors; Wire; Pirani; encapsulation test; gyroscope; vacuum; wafer level test;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
Type :
conf
DOI :
10.1109/SENSOR.2007.4300345
Filename :
4300345
Link To Document :
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