Title :
Measurement study on simultaneous switching noise
Author :
Chen, Liren ; Sen, Bidyut
Author_Institution :
LSI Logic Corp., Milpitas, CA, USA
Abstract :
High-performance chip designs with large numbers of output drivers can be crippled by the simultaneous switching noise. A high-frequency test system for measuring ground bounce is described, along with measurements that were taken on test chips with different packaging design options such as multiple layers and chip capacitors. This paper discusses chip and package design guidelines for noise reduction
Keywords :
electric noise measurement; integrated circuit design; integrated circuit measurement; integrated circuit noise; integrated circuit packaging; chip capacitors; chip design; ground bounce; high-frequency test; multiple layers; output drivers; package design; simultaneous switching noise; Capacitors; Guidelines; Noise measurement; Noise reduction; Oscilloscopes; Packaging; Power generation; Semiconductor device measurement; Switches; System testing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524689
