Title :
1997 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop ASMC 97 Proceedings
Abstract :
The following topics were dealt with. Yield monitoring; simulation; process improvement; process deposition; etching; RTP; defect detection; photoprocessing; workforce development; wafer transport; and inventory control
Keywords :
etching; integrated circuit manufacture; monitoring; personnel; photolithography; rapid thermal processing; semiconductor process modelling; simulation; stock control; RTP; defect detection; etching; inventory control; photoprocessing; process deposition; process improvement; simulation; wafer transport; workforce development; yield monitoring;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI
Conference_Location :
Cambridge, MA, USA
Print_ISBN :
0-7803-4050-7
DOI :
10.1109/ASMC.1997.630651
