DocumentCode
3376562
Title
Three-Dimensional Metal Transfer Micromolded Microelectrode Arrays (MEAS) for In-Vitro Brain Slice Recordings
Author
Rajaraman, Swaminathan ; McClain, Maxine A. ; Choi, Seong-O ; Ross, James D. ; DeWeerth, Stephen P. ; LaPlaca, Michelle C. ; Allen, Mark G.
Author_Institution
Georgia Inst. of Technol., Atlanta
fYear
2007
fDate
10-14 June 2007
Firstpage
1251
Lastpage
1254
Abstract
We report successful electrical characterization and electrophysiological recordings from hippocampal brain slices using metal transfer micromolded three-dimensional microelectrode arrays (3-D MEAs). These MEAs have been fabricated on polymer substrates using metal transfer micromolding. They have further been packaged on glass substrates and insulated using parylene deposition. Recording sites have been defined using laser micromachining and RIE etching. Initial electrical and electrophysiological characterization of the MEAs has been successfully demonstrated in this paper. We believe this fabrication approach enables manufacturing-friendly batch fabrication of truly disposable, biocompatible and cost-effective MEAs, which will be indispensable to the neurophysiology and pharmacology communities.
Keywords
bioelectric phenomena; brain; laser beam machining; microelectrodes; micromachining; neurophysiology; 3D metal transfer micromolded microelectrode arrays; RIE etching; electrical characterization; electrophysiological recordings; hippocampal brain slices; laser micromachining; manufacturing-friendly batch fabrication; neurophysiology; parylene deposition; pharmacology; Brain; Etching; Glass; In vitro; Insulation; Microelectrodes; Micromachining; Optical device fabrication; Packaging; Polymers; Electrophysiological Recordings; Metal Transfer Micromolding; Microelectrode Arrays (MEAs);
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location
Lyon
Print_ISBN
1-4244-0842-3
Electronic_ISBN
1-4244-0842-3
Type
conf
DOI
10.1109/SENSOR.2007.4300364
Filename
4300364
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