• DocumentCode
    3376562
  • Title

    Three-Dimensional Metal Transfer Micromolded Microelectrode Arrays (MEAS) for In-Vitro Brain Slice Recordings

  • Author

    Rajaraman, Swaminathan ; McClain, Maxine A. ; Choi, Seong-O ; Ross, James D. ; DeWeerth, Stephen P. ; LaPlaca, Michelle C. ; Allen, Mark G.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    1251
  • Lastpage
    1254
  • Abstract
    We report successful electrical characterization and electrophysiological recordings from hippocampal brain slices using metal transfer micromolded three-dimensional microelectrode arrays (3-D MEAs). These MEAs have been fabricated on polymer substrates using metal transfer micromolding. They have further been packaged on glass substrates and insulated using parylene deposition. Recording sites have been defined using laser micromachining and RIE etching. Initial electrical and electrophysiological characterization of the MEAs has been successfully demonstrated in this paper. We believe this fabrication approach enables manufacturing-friendly batch fabrication of truly disposable, biocompatible and cost-effective MEAs, which will be indispensable to the neurophysiology and pharmacology communities.
  • Keywords
    bioelectric phenomena; brain; laser beam machining; microelectrodes; micromachining; neurophysiology; 3D metal transfer micromolded microelectrode arrays; RIE etching; electrical characterization; electrophysiological recordings; hippocampal brain slices; laser micromachining; manufacturing-friendly batch fabrication; neurophysiology; parylene deposition; pharmacology; Brain; Etching; Glass; In vitro; Insulation; Microelectrodes; Micromachining; Optical device fabrication; Packaging; Polymers; Electrophysiological Recordings; Metal Transfer Micromolding; Microelectrode Arrays (MEAs);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300364
  • Filename
    4300364