DocumentCode :
3376562
Title :
Three-Dimensional Metal Transfer Micromolded Microelectrode Arrays (MEAS) for In-Vitro Brain Slice Recordings
Author :
Rajaraman, Swaminathan ; McClain, Maxine A. ; Choi, Seong-O ; Ross, James D. ; DeWeerth, Stephen P. ; LaPlaca, Michelle C. ; Allen, Mark G.
Author_Institution :
Georgia Inst. of Technol., Atlanta
fYear :
2007
fDate :
10-14 June 2007
Firstpage :
1251
Lastpage :
1254
Abstract :
We report successful electrical characterization and electrophysiological recordings from hippocampal brain slices using metal transfer micromolded three-dimensional microelectrode arrays (3-D MEAs). These MEAs have been fabricated on polymer substrates using metal transfer micromolding. They have further been packaged on glass substrates and insulated using parylene deposition. Recording sites have been defined using laser micromachining and RIE etching. Initial electrical and electrophysiological characterization of the MEAs has been successfully demonstrated in this paper. We believe this fabrication approach enables manufacturing-friendly batch fabrication of truly disposable, biocompatible and cost-effective MEAs, which will be indispensable to the neurophysiology and pharmacology communities.
Keywords :
bioelectric phenomena; brain; laser beam machining; microelectrodes; micromachining; neurophysiology; 3D metal transfer micromolded microelectrode arrays; RIE etching; electrical characterization; electrophysiological recordings; hippocampal brain slices; laser micromachining; manufacturing-friendly batch fabrication; neurophysiology; parylene deposition; pharmacology; Brain; Etching; Glass; In vitro; Insulation; Microelectrodes; Micromachining; Optical device fabrication; Packaging; Polymers; Electrophysiological Recordings; Metal Transfer Micromolding; Microelectrode Arrays (MEAs);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
Type :
conf
DOI :
10.1109/SENSOR.2007.4300364
Filename :
4300364
Link To Document :
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