Design and fabrication of silicon membrane by wet bulk micromachining process

Author

Pramanick, Bidhan ; Kundu, Pijus ; Bhattacharyya, Tarun K. ; Das, Soumen

Author_Institution

Adv. Technol. Dev. Centre, Indian Inst. of Technol. Kharagpur, Kharagpur, India

fYear

2011

fDate

14-16 Jan. 2011

Firstpage

270

Lastpage

274

Abstract

A silicon membrane is very important part of the MEMS (Micro-Electro-Mechanical System) devices or itself is a useful device. The design and simulation has been performed in COVENTORWARE^® for the fabrication of membrane. The thickness of Piezoelectric actuator is assumed 9mm as this is the thickness of commercially available Lead Zirconate Titanate (PZT) actuator. Potassium Hydroxide (KOH) is used as etchant of silicon for the realisation of 75μm thick silicon membrane. The micromachining is carried out at 70°C using 44% KOH solution. The etch rate depends on the etchant concentration as well as temperature. The etch rate of silicon decreases with the increase of KOH concentration and increases with the increase of temperature. The membrane is designed and fabricated for high fluid pressure application of piezoelectric actuated devices.

Keywords

etching; membranes; micromachining; micromechanical devices; oxygen compounds; piezoelectric actuators; potassium compounds; COVENTORWARE; MEMS; etchant concentration; lead zirconate titanate actuator; micro-electro-mechanical system device; piezoelectric actuated device; piezoelectric actuator; potassium hydroxide; silicon membrane design; silicon membrane fabrication; temperature 70 C; wet bulk micromachining process; Actuators; Educational institutions; Electromagnetics; Etching; Micromechanical devices; Sensors; Coventorware; KOH; Membrane; Micromachining; PZT; Piezoelectric actuation;

fLanguage

English

Publisher

ieee

Conference_Titel

Students' Technology Symposium (TechSym), 2011 IEEE

Conference_Location

Kharagpur

Print_ISBN

978-1-4244-8941-1

Type

conf

DOI

10.1109/TECHSYM.2011.5783828

Filename

5783828