DocumentCode :
3376683
Title :
Characterization of electrode/electrolyte interface for bioimpedance study
Author :
Pradhan, Rangadhar ; Mitra, Analava ; Das, Soumen
Author_Institution :
Sch. of Med. Sci. & Technol., Indian Inst. of Technol. Kharagpur, Kharagpur, India
fYear :
2011
fDate :
14-16 Jan. 2011
Firstpage :
275
Lastpage :
280
Abstract :
The electrochemical impedance spectroscopy (EIS) methodology has been extensively used to study the different aspects of electrochemical and biomedical practices. This paper presents the numerical simulation of impedance for electrode/electrolyte interface. The COMSOLR Multiphysics is used to study the interface impedance. The technology for Micro Electro Mechanical system (MEMS) helps to fabricate miniature devices for the electrochemical study. In this work a MEMS based three electrode device along with Phosphate Buffered Solution (PBS) is simulated using COMSOL Multiphysics to find out the impedance of interface. PBS is used as physiological medium for most biological studies and also used to stabilize the microelectrodes under testing. The impedance obtained from COMSOL Multiphysics is processed with an equivalent circuit simulator named as ZsimpWin to find the viability of impedance of electrode/electrolyte interface.
Keywords :
bioMEMS; bioelectric phenomena; biomedical electrodes; electrochemical impedance spectroscopy; electrolytes; equivalent circuits; microelectrodes; solutions; COMSOL Multiphysics; ZsimpWin; bioMEMS; bioimpedance; electrochemical impedance spectroscopy; electrode-electrolyte interface; equivalent circuit simulator; micro electro mechanical system; microelectrodes; phosphate buffered solution; physiological medium; Capacitance; Electrodes; Impedance; Integrated circuit modeling; Mathematical model; Micromechanical devices; Surface impedance; COMSOLR Multiphysics; EIS; PBS; ZsimpWin; electrochemical impedance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Students' Technology Symposium (TechSym), 2011 IEEE
Conference_Location :
Kharagpur
Print_ISBN :
978-1-4244-8941-1
Type :
conf
DOI :
10.1109/TECHSYM.2011.5783829
Filename :
5783829
Link To Document :
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