DocumentCode :
3376700
Title :
REAL Routing: REputation Based Approach on 2.5-Layer Routing for Reliable Packet Delivery in Wireless Multi-Hop Networks
Author :
Kim, Byounghoon ; Lee, Donggeon ; Shin, Junghwa ; Park, E.K. ; Tak, Sungwoo
Author_Institution :
Sch. of Comput., Pusan Nat. Univ., Busan
fYear :
2008
fDate :
3-7 Aug. 2008
Firstpage :
1
Lastpage :
6
Abstract :
This paper presents a framework of wireless multi-hop networks exploiting an ad hoc routing protocol working on the layer 2.5, called REAL (reputation based approach on 2.5-Layer) routing protocol. The framework of REAL routing protocol incorporates following three things: a new concept of wireless multi-hop network architecture, a new 2.5-layer routing technique with a reputation management scheme, and high throughput network performance based on cross-layer approaches between MAC (medium access control) and REAL layers. We compare the performance of the REAL routing protocol with previous routing algorithms, DSR (dynamic source routing) and AODV (ad hoc on demand distance vector). A case study on practical experiments and simulations shows that the REAL routing protocol yields better performance in terms of low rate of packet loss, fast packet delivery time, and high throughput network performance.
Keywords :
access protocols; ad hoc networks; radio networks; routing protocols; 2.5-layer routing technique; ad hoc routing protocol; medium access control; packet delivery; reputation management scheme; wireless multihop networks; Computer science; Media Access Protocol; Mobile ad hoc networks; Mobile communication; Noise measurement; Performance loss; Reliability engineering; Routing protocols; Spread spectrum communication; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Communications and Networks, 2008. ICCCN '08. Proceedings of 17th International Conference on
Conference_Location :
St. Thomas, US Virgin Islands
ISSN :
1095-2055
Print_ISBN :
978-1-4244-2389-7
Electronic_ISBN :
1095-2055
Type :
conf
DOI :
10.1109/ICCCN.2008.ECP.76
Filename :
4674236
Link To Document :
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