Toward the integration of microsystems supply

Author

Estibals, Bruno ; Alonso, Corinne ; Salles, Alain ; Cid-pastor, Angel ; Camon, Henri ; Martinez-salamero, Luis

Author_Institution

Lab. d´´Analyse et d´´Architecture des Systemes, CNRS, Toulouse, France

Volume

5

fYear

2004

fDate

23-26 May 2004

Abstract

This work presents a global methodology for the complete design of an integrated inductor. After describing the different existing topologies, a method providing the geometrical dimensions from the desired inductance value is reported. Then, the frequency dependency of the inductance and its parasitic capacitance and resistance are analyzed by means of specific CAD tools. A specific analysis of thermal failure mechanisms is presented next. Temperature and current density of different shapes of connection pad are subsequently studied.

Keywords

capacitance; circuit CAD; electric resistance; inductance; inductors; micromechanical devices; network topology; temperature; CAD tool; connection pad shapes; current density; frequency dependent analysis; inductance value; integrated inductor design; microsystems supply integration; parasitic capacitance; parasitic resistance; temperature; thermal failure mechanism analysis; Current density; Design automation; Failure analysis; Frequency; Inductance; Inductors; Parasitic capacitance; Shape; Temperature; Topology;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on

Print_ISBN

0-7803-8251-X

Type

conf

DOI

10.1109/ISCAS.2004.1329724

Filename

1329724