DocumentCode :
3376790
Title :
Temperature effect on space charge dynamics in multi-layer insulation Fluorinated Ethylene Propylene (FEP) Low Density Polyethylene (LDPE)
Author :
Rogti, F. ; Ferhat, Mh
Author_Institution :
Dielectr. Mater. Lab., Univ. of Amar Tlidji, Laghouat, Algeria
fYear :
2013
fDate :
20-23 Oct. 2013
Firstpage :
283
Lastpage :
286
Abstract :
Space charge behavior at dielectric interfaces in multi-layer Fluorinated Ethylene Propylene (FEP) and Low Density Polyethylene (LDPE) subjected to a dc field has been investigated as a function of the temperature using the pulsed electro acoustic (PEA) technique. A sandwich structure constituted by two dielectric films not identical FEP/LDPE was used to study the charging propensity of electrode/dielectric and dielectric/ dielectric interface. The time dependence of the space charge distribution was subsequently recorded at different temperature under field (polarization) and short circuit condition (depolarization). Experimental results demonstrated that charge injected process take place in all cases. However it is shown that the amount of interfacial charge depends drastically on the temperature. It has greater influence on the distribution, injection and mobility of space charge in the bulk and at dielectric/ dielectric interfaces.
Keywords :
dielectric devices; electrochemical electrodes; polyethylene insulation; pulsed electroacoustic methods; space charge; FEP; LDPE; PEA; charging propensity; dielectric-dielectric interface; electrode-dielectric interface; interfacial charge; multilayer insulation fluorinated ethylene propylene; multilayer insulation low density polyethylene; polymers materials; pulsed electro acoustic technique; short circuit condition; space charge distribution; space charge dynamics; temperature effect; Anodes; Cathodes; Dielectrics; Insulation; Space charge; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/CEIDP.2013.6747096
Filename :
6747096
Link To Document :
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