Title :
Time and frequency domain analysis of integral decoupling capacitors
Author :
Goetz, Martin P.
Author_Institution :
Technol. Group, ASAT Inc., Palo Alto, CA, USA
Abstract :
Decoupling capacitors have been designed and included in high speed packaging systems to avoid voltage drops across the power supply caused by interconnect inductance. The effectiveness of certain types of decoupling capacitors is reviewed using both time and frequency domain modeling and measurement techniques. The results will provide insight into the effectiveness of certain types of capacitors used within a system
Keywords :
capacitors; frequency-domain analysis; packaging; time-domain analysis; frequency domain analysis; high speed packaging systems; integral decoupling capacitors; interconnect inductance; power supply; time domain analysis; voltage drops; Bandwidth; Capacitors; Equations; Frequency domain analysis; Frequency measurement; Impedance measurement; Integrated circuit interconnections; Packaging; Permittivity; Time measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524693
