• DocumentCode
    3377406
  • Title

    High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

  • Author

    Tanaka, Toshikatsu ; Wang, Zengbin ; Iizuka, Tomonori ; Kozako, Masahiro ; Ohki, Yoshimichi

  • Author_Institution
    IPS Res. Center, Waseda Univ., Kitakyushu, Japan
  • fYear
    2011
  • fDate
    22-24 Dec. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m·K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
  • Keywords
    composite materials; electric breakdown; surface treatment; thermal conductivity; high breakdown strength; high thermal conductivity epoxy/BN composites; material conditions; nano filler addition; sufficient dielectric breakdown strength; surface treatment; Conductivity; Dielectric breakdown; Educational institutions; Materials; Silicon compounds; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power and Energy Systems (ICPS), 2011 International Conference on
  • Conference_Location
    Chennai
  • Print_ISBN
    INAVLID ISBN
  • Type

    conf

  • DOI
    10.1109/ICPES.2011.6156695
  • Filename
    6156695
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3377406