• DocumentCode
    3377438
  • Title

    Analysis of shielding enclosures using the multilevel plane wave time domain algorithm

  • Author

    Aygun, K. ; Shanker, B. ; Ergin, A.A. ; Michielssen, E.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    690
  • Abstract
    While both integral and differential equation based time domain solvers have been known to the CEM community for many years, the latter are usually chosen for analyzing EMI/EMC problems. This is due to the fact that classical time domain integral equation solvers, such as the marching-on-in-time (MOT) method, suffer from a high computational complexity. Indeed, the memory requirements and the computational cost associated with the MOT method scale as O(NS2) and O(NTNS2), where NT is the duration of the simulation in terms of time steps and NS is the number of spatial unknowns. To reduce these costs, the multilevel plane wave time domain algorithm (MLPWTD) was introduced previously; this algorithm reduces the memory requirements and computational cost to O(NTNS) and O(NTNS log2 NS), respectively. This paper illustrates the application of the MLPWTD solver to the analysis of radiation characteristics of wires and perfect electrically conducting (PEC) modules on motherboard configurations that reside in shielding enclosures. Numerical results are presented that demonstrate the efficacy and applicability of the algorithm to the analysis of complex structures
  • Keywords
    computational complexity; difference equations; electromagnetic compatibility; electromagnetic interference; electromagnetic shielding; integral equations; modules; time-domain analysis; wires (electric); EMI/EMC problems; computational cost reduction; differential equation; high computational complexity; integral equation; marching-on-in-time method; memory requirements reduction; motherboard configurations; multilevel plane wave time domain algorithm; perfect electrically conducting modules; radiation characteristics; shielding enclosures; simulation duration; time domain solvers; wires; Computational complexity; Computational efficiency; Computational modeling; Costs; Differential equations; Electromagnetic compatibility; Electromagnetic interference; Integral equations; Time domain analysis; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1999 IEEE International Symposium on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    0-7803-5057-X
  • Type

    conf

  • DOI
    10.1109/ISEMC.1999.810101
  • Filename
    810101