Title :
Low loss wide band filters and resonator filters using high temperature stable high electromechanical coupling surface acoustic wave substrates
Author :
Yamanouchi, Kazuhiko ; ISHII, Toru
Author_Institution :
Tohoku Inst. of Technol., Sendai, Japan
Abstract :
The important properties required for SAW substrates are a large electromechanical coupling coefficients (k2), small temperature coefficient of frequency (TCF), low propagation loss, etc. LiNbO2 has good properties as the SAW substrate with a large size. Unfortunately LiNbO3 possesses the large values of TCF. We developed the SiO2/Rotated Y-cut, X-Propagating LiNbO3 leaky SAW substrates with a large k2(over 0.2) and zero TCF at very thin thickness of SiO2 of H/λ = 0.2 (H:SiO2 film thickness, λ :SAW wave-length) and zero propagation attenuation in the case of moralized surface. In this paper, the theoretical and experimental results of SAW filters, resonators and resonator filters are described. The low loss filters using FEUDT showed the insertion loss of below 2dB at the center frequency of 400MHz and bandwidth of 20MHz. Also, the resonator showed the band width of 70MHz at the center frequency of 500MHz and resonator filters showed the band width of 80MHz at the center frequency of 500MHz.
Keywords :
band-pass filters; dielectric losses; electromechanical effects; electromechanical filters; lithium compounds; piezoelectric materials; surface acoustic wave filters; surface acoustic wave resonator filters; 2 dB; 20 MHz; 400 MHz; 500 MHz; 70 MHz; 80 MHz; LiNbO3; SAW filters; SAW substrates; high temperature stable high electromechanical coupling surface acoustic wave substrates; leaky SAW substrates; low loss wide band filters; low propagation loss; moralized surface; resonator filters; resonators; small temperature coefficient of frequency; zero propagation attenuation; Acoustic waves; Attenuation; Frequency; Propagation losses; Resonator filters; Substrates; Surface acoustic waves; Surface waves; Temperature; Wideband;
Conference_Titel :
Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE
Print_ISBN :
0-7803-7582-3
DOI :
10.1109/ULTSYM.2002.1193381